歷年優秀論文獎助 > 2010優秀學位論文得獎名單 >高靜吟
| 研究生 | 高靜吟 |
| 研究生(外文) | Ching-Yin Kao |
| 論文名稱 | 化學機械研磨墊專利發展趨勢分析 |
| 論文名稱(外文) | Longitudinal Patent Analysis for Chemical Mechanical Polishing Pad |
| 指導教授 | 謝寶煖 |
| 指導教授(外文) | Pao-Nuan Hsieh |
| 口試委員 | |
| 口試日期 | |
| 學位類別 | 碩士 |
| 校院名稱 | 國立臺灣大學 |
| 系所名稱 | 圖書資訊學研究所 |
| 論文出版年 | 2010 |
| 畢業學年度 | 98 |
| 語文別 | 中文 |
| 論文頁數 | 212 |
| 中文關鍵詞 | 專利、專利引證、化學機械研磨、研磨墊、知識外溢、知識流向 |
| 外文關鍵詞 | patent、patent citation、Chemical Mechanical Polishing、CMP、CMP Pad、knowledge spillover、knowledge flow |
| 中文摘要 | 隨著積體電路製程的微細化發展，全面平坦化之技術也日趨重要，而化學機械研磨（Chemical Mechanical Polishing）是目前達成全面平坦化最有效且最具成本效益的關鍵技術。研磨墊（Pad）為CMP製程的重要耗材之ㄧ，且對研磨率與均勻度的影響甚鉅。本研究之目的為分析CMP Pad專利之發展趨勢，包含隨著時間的演變，CMP Pad專利的整體、各國、各廠商、各產業及各技術類別的發展趨勢；並以專利引證與被引證機率進行CMP Pad之知識外溢分析，包含CMP Pad專利的各國、各廠商、各產業及各技術類別的知識外溢與流向。 研究結果分項說明如下：（1）美國為CMP Pad專利之標竿國家。（2）羅門哈斯公司為CMP Pad專利之標竿廠商。（3）CMP Pad專利之主要產業為半導體與相關元件產業（3674類）。（4）CMP Pad專利技術主要集中於用於磨削或拋光之機床、裝置或工藝類（B24B）與磨削、拋光或刃磨用之工具類（B24D）類IPC技術，尤其是有關研光機床或裝置之適用於加工平面者之技術（B24B 37/04）。（5）美國CMP Pad專利之引證專利之知識外溢具有地理區域集中趨勢。（6）美國、日本、台灣與南韓CMP Pad專利之知識流向呈現四國雙向流向，尤其是美國與日本之間。（7）羅門哈斯公司、美光科技、應用材料與國際商用機器公司CMP Pad專利之知識呈現四廠商雙向流向。（8）台灣積體電路製造股份有限公司、聯華電子股份有限公司與旺宏電子股份有限公司之CMP Pad專利均與應用材料之專利知識呈現兩廠商雙向流向。（9）7379類、3674類與2821類，以及3674類與3559類分別與2821類、3663類與7379類SIC之CMP Pad專利知識呈現三產業雙向流向。（10）B24B 37/04類與B24D 3/20類分別與B24D 7/12類及B24D 3/34類IPC之CMP Pad專利知識呈現三技術類別雙向流向。 |
| 外文摘要 | As the feature sizes of Integrated Circuits continue to shrink, the ability to globally planarize the wafer surface becomes increasingly important. The Chemical Mechanical Polishing or Planarization (CMP) is regarded as the most successful planarization process in IC fabrication. CMP has the capability to achieve global planarization of interlayered dielectrics and metal films and its relative cost-effectiveness. The CMP Pad is one of the most important consumables in CMP and has a critical effect on achieving controlled material removal and uniformity. The objective of this study is to learn the CMP Pad development trend by using patent analysis first, including the number of patents, countries, companies, industries and technical classifications. Second, it’s to learn the CMP Pad technological knowledge spillover and flow by using patent citation analysis, including the countries, companies, industries and technical classifications. Achievement of this study includes the following items: (1) USA is the leading country of CMP Pad technologies. (2) Rohm & Haas Co. is the leading company of CMP Pad technologies. (3) The Semiconductors and Related Devices industry （3674）published the most CMP Pad patents. (4) The CMP Pad technologies are focused on B24B and B24D of IPC, B24B 37/04 especially. (5) There is the geographic localization of knowledge spillover on the patent citations in US. (6) There are two-way knowledge flows among US, JP, TW and KR, between US and JP especially. (7) There are two-way knowledge flows among Rohm & Haas Co., Micron Technology, Inc., Applied Materials, Inc. and IBM Corp.. (8) There are two-way knowledge flows between Taiwan Semiconductor Manufacturing Co., Ltd. and Applied Materials, Inc., United Microelectronics Corp. and Applied Materials, Inc., Macronix International Co., Ltd. and Applied Materials, Inc.. (9) There are two-way knowledge flows among 7379, 3674 and 2821 SIC; 3559, 3674 and 3663 SIC; 3559, 3674 and 7379 SIC; 3559, 3674 and 2821 SIC. (10) There are two-way knowledge flows among B24B 37/04, B24D 3/20 and B24D 7/12 IPC; B24B 37/04, B24D 3/20 and B24D 3/34 IPC. |
| 連結 | 臺灣博碩士論文知識加值系統 |